Product Description:
The Carbon fiber thermal plate is primarily composed of thermally conductive carbon fiber, positioned between heating components and heat sinks. This gasket fills the gaps between the two, facilitating the rapid dissipation of electronic device heat, thereby enhancing the performance and longevity of electronic products. Thermally conductive carbon fiber is a highly thermally conductive material with robust mechanical properties and exceptional heat dissipation capabilities through both conduction and radiation. The fibrous high thermal conductive carbon powder derived from this carbon fiber exhibits fibrous structure and can be oriented for enhanced heat dissipation, marking a significant departure and advantage over previous thermal conductive materials.
Compared to the conventional thermal conductive silicone gaskets currently available in the market, the CSF series carbon fiber thermal conductive gaskets exhibit substantial improvements in key parameters including thermal resistance, thermal conductivity, ease of use, flame retardant rating, and gasket lifespan. These gaskets are frequently utilized in cooling systems for portable electronic devices, including high-heat-dissipation products such as 5G smartphones, AR glasses, automotive electronics, and communication equipment.

Product parameters:
|
parametersTXW30
|
|
Color
|
Black |
visual |
|
Thickness
|
0.5~20.0mm
|
ASTMD374
|
|
Density
|
2.9g/cm3
|
ASTMD792
|
|
Thermal conductivity
|
30.0W/m.k
|
ASTMD5470
|
|
hardness
|
40/60±5
|
ASTMD2240
|
|
Elongation
|
20%
|
ASTMD412
|
|
Tensile strength
|
30psi
|
ASTMD412
|
|
Dielectricbreakdownvoltage
|
>8000V/mm
|
ASTMD149
|
|
Fire rating
|
UL94V-0
|
UL
|
|
Volumetric resistance
|
1*1013Ω.cm
|
ASTMD257
|
|
temperature
|
-50~160℃
|
***
|
|
thermal resistance(1mm,@30ps)
|
0.05℃*in2/W
|
ASTMD5470
|
| compression ratio |
5-35%
|
***
|
|
RoHS
|
PASS
|
IEC62321
|
|
Halogen
|
PASS
|
EN14582
|
|
REACH
|
PASS
|
EN14372
|
Features And Benefits:
1、High thermal conductity
2、Excellent flame retardancy
3、Good flexibility and high compressionrata
Applications:
●Semiconductor heat dissipation device
●Vehiclenavigator
●Communication power supply equipment
●Graplics card,memorymoduld
● LED lighting equipment
●LCD and plasma TV
Product specifications:
According to customer requirements
Storage&Transportation:
Store in a ventilated, cool, and dry place, do not come into contact with open flames. This product is non-toxic and is stored and transported as a non hazardous material
Packaging:
Customized packaging according to customer needs
Shelf life:
24 months