HomeWhy should the substrate also be baked or warmed
Dec 13,2022
Hanast
When the temperature is low, the surface activity of the substrate will also decrease. The bonding process is a process in which glue and the substrate adsorb each other to form a bonding force. It is often not the best to improve the activity of one of them alone. If conditions permit, it is best to consider both sides
What is the baking temperature range of the thermostat or oven? Can you directly use high temperature? What are some precautions
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