Adhesive Scheme for Notebook Heat Dissipation Adhesive

Notebooks have been developing for many years, and their appearance is becoming more and more fashionable and thinner. The demand for production is becoming more and more strict, and the notebook hardware equipment is getting smaller and smaller with the progress. In this context, the heat dissipation problem will be solved.
Glue analysis and solution
1、 Adhesive for bonding and sealing
Glue application part: bonding the radiator frame
Glue requirements: high temperature resistance, high bonding strength, waterproof, insulation, aging resistance
Recommended glue: HN-806W-2 high-strength single component silicone sealant
Reason for recommendation: HN-806W-2 is applicable to high-strength bonding between metals, plastics, glass, silica gel and other materials; Waterproof grade IP68, high and low temperature resistance (- 60-260), insulation, aging resistance and other characteristics.

2、 Adhesive for heat conduction
Glue application position: bonding between the heat generator and the heat conducting material
Requirements for glue: high temperature resistance, good heat dissipation and high thermal conductivity
Recommended glue: HN-302 thermal conductive silicone grease
Reason for recommendation: HN-302 is applicable to the transmission medium of electronic components. It can effectively reduce the working temperature of heating elements with high temperature resistance of 200 ℃ and no dryness, good heat dissipation and high thermal conductivity (4.0-6.0).