Rubber scheme for LED drive power supply
Oct 26,2022 Hanast
LED power supply is a kind of power supply, also known as power supply, it is to provide LED lighting power, because of the characteristics of LED beads, LED beads can only use dc drive, so in the city electricity (city is ac) and LED, need an integrated circuit to ac into dc, the integrated circuit is LED control drive。
LED drive power filling glue is used in LED drive power supply, after curing can avoid components for direct contact with natural environment, effectively prevent components by the environment erosion, slow the aging of power internal components, and LED drive power sealing glue also has excellent thermal conductivity and heat resistance, can be the LED drive power heat efficient conduction to heat shell, prevent LED drive power temperature is too high and failure. The use of LED drive power supply after filling glue, can effectively prevent the infiltration of rain, even if the impact of cold and cold of-60℃ ~200℃, still will not produce any cracks, effectively improve the moisture-proof performance of LED drive power supply. LED drive power filling glue is suitable for general electronic components, power supply module and circuit board sealing protection, as well as various electronic and electrical appliances, such as switch power supply, drive power supply, automotive HID lamp module power supply, automotive ignition system module power supply, home appliance controller, network transformer, etc
[PCB plate sealing]
HN-8806 silicone filling glue Two-component plus molded silicone rubber |
model | Applications | product type | Product group type | condition of cure | With glue point |
HN-8806A/B | LED source | organic silicon | bi-component | Room temperature / heat and curing | PCB embedment |
HN-601C-1 | LED source | organic silicon | Single component | room curing | The threading slot is sealed |
HN-501C-1 | LED source | organic silicon | Single component | room curing | Welding point isolation |
Use glue guide
Operation process
Compactions A and B are stirred evenly in their respective packages before the glue application, because the filler may partially settle during the storage process.
Components A and B are weighed in a 1:1 ratio, evenly mixed, and directly injected into the components (or modules) requiring sealing and protection. It is best to inject slowly along the side of the wall to reduce the production of bubbles